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The ST33KTPM2IWLBZA9 is a flash memory-based Trusted Platform Module (TPM) compliant with TCG TPM Library specifications 2.0, revision 1.59 errata version 1.4, and TCG PC Client TPM Profile (PTP) for TPM 2.0 version 1.06. It supports both SPI (up to 48 MHz) and I²C (up to 1 MHz) interfaces. The device operates within an extended temperature range of −40 °C to 105 °C and accepts a supply voltage between 1.8 V and 3.3 V. It features SP800-193 compliance, fault-tolerant firmware loading, and targeted Common Criteria EAL4+ and FIPS 140-3 certifications.
Verify the factory firmware version associated with the ZA9 suffix against current requirements. The ZA9 variant ships with firmware version 10.257, whereas newer revisions may use version 10.512. Confirm that the specific cryptographic algorithms supported in version 10.257 meet the project's security standards before procurement.
Select this component when a WLCSP24 package is required for space-constrained designs. Ensure the system design accommodates the 1.8 V to 3.3 V supply voltage range and provides adequate filtering on the VCC line as specified in the electrical integration guidance. Verify interface selection via the GPI_I2C_Select pin configuration during boot.
This part belongs to the ST33KTPM2I family of STSAFE-TPM devices designed for consumer and industrial applications. The 'W' indicates the WLCSP24 package, 'L' denotes the lead-free ECOPACK grade, 'B' signifies the ball grid array type, and 'ZA9' identifies the specific factory firmware version 10.257 and marking scheme.
ST33KTPM2IWLBZB1: Identical WLCSP24 package but ships with factory firmware version 10.512, which includes additional algorithm support such as SHA-512 and Ed448.