STGD8NC60KDT4

STGD8NC60KDT4

$2.00
  • Description:IGBT 600V 15A 62W DPAK
  • Series:PowerMESH™

SKU:a445ed0236c8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT 600V 15A 62W DPAK
  • Series:PowerMESH™
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • IGBT Type:-
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):15 A
  • Current - Collector Pulsed (Icm):30 A
  • Vce(on) (Max) @ Vge, Ic:2.75V @ 15V, 3A
  • Power - Max:62 W
  • Switching Energy:55µJ (on), 85µJ (off)
  • Input Type:Standard
  • Gate Charge:19 nC
  • Td (on/off) @ 25°C:17ns/72ns
  • Test Condition:390V, 3A, 10Ohm, 15V
  • Reverse Recovery Time (trr):23.5 ns
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:TO-252-3, DPAK (2 Leads + Tab), SC-63
  • Supplier Device Package:DPAK
  • Grade:-
  • Qualification:-

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STGD8NC60KDT4

Overview

The STGD8NC60KDT4 is an N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by STMicroelectronics. It features a maximum continuous collector current of 8 A and a collector-emitter voltage rating of 600 V. The device utilizes advanced PowerMESH technology to achieve low on-state voltage drop and optimized switching performance. It is housed in a DPAK (TO-252) surface-mount package with three pins. Key electrical limits include a maximum power dissipation of 65 W, a gate-emitter voltage range of ±20 V, and a short-circuit withstand time of 10 μs. The operating junction temperature range spans from -55 °C to +150 °C.

Feature Summary

  • Developed using advanced PowerMESH technology for excellent trade-off between switching performance and low on-state behavior.
  • Features a very soft ultra-fast recovery antiparallel diode integrated within the device.
  • Designed with a lower C_res / C_ies ratio to eliminate cross-conduction susceptibility.
  • Capable of withstanding short-circuit conditions for up to 10 microseconds.

Applications

  • Resonant or soft-switching applications
  • High frequency inverters
  • Motor drives

Procurement Notes

Verify the specific manufacturer datasheet revision and ordering suffixes to ensure compatibility with design requirements. Confirm that the DPAK package dimensions align with PCB footprint specifications. Check for RoHS compliance status if environmental regulations apply to the target assembly. Ensure thermal management solutions account for the specified power dissipation limits at expected operating temperatures.

Selection Notes

Select this component when a 600 V blocking capability and 8 A continuous current are required in a compact surface-mount form factor. The integrated fast recovery diode makes it suitable for half-bridge configurations where freewheeling paths are needed. Consider the 10 μs short-circuit ruggedness for protection circuitry design. Evaluate thermal resistance characteristics against the application's heat sinking capabilities to maintain junction temperatures within safe operating limits.

Part Context

This part belongs to the STGxNC60KD series of short-circuit rugged IGBTs from STMicroelectronics. The 'D' in the model number indicates the DPAK (TO-252) package variant, distinguishing it from TO-220FP or D²PAK versions like the STGB or STGF series. These devices share common technological foundations based on PowerMESH architecture but differ in current ratings and physical packaging constraints.

Replacement Considerations

Direct replacements within the same family include STGP8NC60KD (TO-220FP package) or STGB8NC60KDT4 (TO-263 package). Cross-package substitution requires verification of pinout compatibility and mechanical mounting differences. Alternative manufacturers may offer similar 600 V/8 A IGBTs, but electrical parameters such as Vce(sat) and switching times must be compared against the original datasheet specifications.

STGD8NC60KDT4STGD8NC60KDT4
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