SX2M33.8688B10F20TNN

Oscillators Overview

The SX2M33.8688B10F20TNN is a CMOS crystal oscillator manufactured by Shenzhen SCTF Electronics. It operates at a nominal frequency of 33.8688 MHz with a standard output type. The device is powered by a 3.3V supply and features enable/disable control functionality. It is housed in a compact 4-SMD, no-lead package suitable for surface mount applications. The unit supports an operating temperature range from -40°C to +85°C, ensuring reliability across various industrial environments.

Oscillators Feature Summary

• CMOS output interface for digital logic compatibility
• Active enable and disable control capability
• Industrial-grade wide temperature operation range

Oscillators Applications

• General-purpose clock signal generation
• Embedded system timing references
• Digital communication interfaces

Oscillators Procurement Notes

Verify the specific suffix B10F20 against official datasheets to confirm tolerance and stability grades. Ensure the 3.3V supply voltage aligns with target circuit requirements. Confirm the 4-SMD footprint matches PCB layout constraints before finalizing procurement orders.

Oscillators Selection Notes

Select this component when a stable 33.8688 MHz reference is required for CMOS-based designs. Consider the enable pin feature if power management or clock gating is necessary. Evaluate thermal performance within the specified -40°C to +85°C range for the intended application environment.

Oscillators Part Context

This oscillator belongs to the SX2M series from Shenzhen SCTF Electronics, designed for standard clocking needs. The series typically offers CMOS outputs in small form factors. This specific model provides a precise frequency for synchronization tasks in consumer and industrial electronics.

Oscillators Replacement Considerations

Cross-reference with other 33.8688 MHz CMOS oscillators in 4-SMD packages. Verify electrical parameters such as load capacitance and drive level compatibility. Check pinout configurations to ensure direct replacement feasibility without PCB redesign.