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TB-48.000MBD-T is listed in the Oscillators range at ChipApex. The manufacturer field lists TXC CORPORATION. Its product description is MEMS OSC XO 48.0000MHZ CMOS SMD. Review the specifications below when checking this part for your BOM.
The TB-48.000MBD-T is a MEMS-based standard clock oscillator manufactured by TXC Corporation, operating at a nominal frequency of 48.000 MHz. It utilizes CMOS output format and is designed for surface-mount applications in a 4-SMD, no-lead package configuration. The device supports a supply voltage of 3.3V and offers a frequency stability of ±25 ppm. It is rated for an industrial temperature range spanning from -40°C to +85°C, ensuring reliable performance in demanding electronic environments.
Verify the specific suffix requirements against the official TXC Corporation datasheet to ensure correct packaging and tolerance specifications. Confirm that the 3.3V supply voltage aligns with the target circuit design before procurement. Check for RoHS compliance status if environmental regulations apply to the end product. Ensure the selected distributor is authorized to provide genuine components with traceable documentation.
Select this component when a MEMS oscillator is preferred over quartz for improved shock and vibration resilience. The ±25 ppm stability suits general-purpose timing applications where ultra-high precision is not critical. Consider the 4-SMD footprint for space-constrained PCB layouts. Verify that the CMOS output drive strength meets the input requirements of the connected load circuitry.
This part belongs to the TB series of standard clock oscillators from TXC Corporation, which focuses on MEMS-based timing solutions. The series is designed to replace traditional quartz oscillators in applications requiring higher durability. The 48 MHz frequency is commonly used in USB interfaces and various synchronous communication standards.
Cross-reference with other MEMS oscillators offering identical 48 MHz frequency, 3.3V operation, and ±25 ppm stability. Ensure pinout compatibility and package dimensions match the existing PCB footprint. Verify that alternative suppliers provide equivalent thermal and electrical characteristics.
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