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The TDA1517ATW/N1,118 is an integrated Class-AB power amplifier manufactured by NXP Semiconductors. It operates on a single supply voltage ranging from 6 V to 18 V and delivers up to 8 W in Bridge-Tied Load (BTL) configuration or 4 W per channel in Single-Ended (SE) stereo mode. The device features a fixed gain of 20 dB for SE applications and 26 dB for BTL configurations. It utilizes a 20-lead HTSSOP package with an exposed thermal pad for efficient heat dissipation.
Verify the specific ordering suffix /N1,118 against current NXP documentation to confirm availability status. Confirm that the HTSSOP20 package dimensions match the target PCB footprint. Ensure proper thermal management design is implemented due to the exposed die pad requirement for adequate heat sinking.
Select this component when a high-power output is required within a compact surface-mount form factor. The differential input stages allow for straightforward interfacing with standard audio sources. Consider the low quiescent current in standby mode for battery-operated or energy-efficient system designs requiring minimal power drain during idle periods.
This part belongs to the TDA1517 series of audio power amplifiers designed primarily for multimedia applications. It provides a robust solution for driving speakers with high efficiency and low distortion. The device integrates multiple protection mechanisms to ensure reliability under various load conditions and fault scenarios common in consumer electronics environments.
Direct replacement requires matching the HTSSOP20 package and electrical specifications. Verify compatibility with existing circuit board layouts and thermal requirements. Consult official NXP documentation for any updated versions or alternative packages within the same product family.
The MODE pin controls three states: Standby (0–2 V), Mute (3.3–6.4 V), and Operating (8.5 V to VP). This allows low-current microcontroller control without significant power draw.
The SVRR pin improves Supply Voltage Ripple Rejection. In Single-Ended applications, connecting a capacitor here reduces noise and ripple on the midrail voltage, enhancing overall audio performance.
Thermal dissipation is managed through the exposed die pad on the bottom of the package. It must be soldered efficiently to a thermal land on the PCB with vias to transfer heat to other copper layers.