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The TDA1519CTH is a Class-B dual output audio amplifier manufactured by NXP Semiconductors, housed in a 20-lead heatsink small outline package (HSOP20) with a low stand-off height. It supports stereo operation delivering up to 11 W per channel into a 2 Ω load at 14.4 V supply, or Bridge-Tied Load (BTL) configuration providing up to 22 W into a 4 Ω load. The device features a fixed voltage gain of 40 dB, operates within a supply voltage range of 6.0 V to 17.5 V, and includes integrated mute/standby functionality.
Verify the specific ordering suffix 'N3,518' against current NXP documentation to confirm availability status and exact manufacturing lot specifications. Ensure the selected HSOP20 variant matches the required thermal management strategy, as the TH version utilizes a top-mounted heatsink distinct from the TD bottom-heatsink design.
Select this component when a high-output power amplifier is needed in a surface-mount format with integrated thermal dissipation capabilities. The TDA1519CTH is suitable for designs requiring a low stand-off height profile while maintaining the electrical performance of the TDA1519C family. Consider the fixed 40 dB gain and input impedance characteristics during circuit topology planning.
This part belongs to the TDA1519C series of integrated class-B dual output amplifiers. It is pin-compatible with the TDA1519B and other variants within the TDA1519 family, facilitating direct upgrades or replacements in existing designs. The TH package variant specifically offers a low stand-off height compared to standard HSOP packages.
The TDA1519CTD is a compatible alternative featuring a bottom-facing heatsink for PCB soldering instead of a top-mounted heatsink. Both parts share identical electrical specifications and pinouts.