TDA2822

Overview

The TDA2822 is a monolithic dual audio power amplifier manufactured by STMicroelectronics, housed in a 16-pin Powerdip (Plastic 12+2+2) package. It operates on a supply voltage range of 3 V to 15 V with a maximum output peak current of 1.5 A and total power dissipation up to 4 W at a case temperature of 70 °C. The device supports both stereo and bridge configurations, delivering up to 3.2 W per channel into an 8 Ω load at 9 V supply. Key electrical characteristics include a closed-loop voltage gain of 39 dB, input bias current of 100 nA, and low quiescent drain current.

Feature Summary

• Supports flexible stereo or bridge-tied load (BTL) operational configurations
• Operates effectively with low supply voltages starting from 3 V
• Features low crossover distortion for improved audio fidelity
• Maintains low quiescent current consumption

Applications

• Portable radios
• Television sets (TS)
• Low-power audio amplification circuits

Procurement Notes

Verify component status as the datasheet explicitly identifies the TDA2822 as obsolete. Confirm availability through authorized distributors or secondary markets. Ensure the specific 16-pin Powerdip package matches the design requirements, as surface-mount alternatives like the TDA2822D exist but differ physically.

Selection Notes

Select this component for applications requiring a robust dual-channel amplifier in a through-hole Powerdip package. It is suitable for designs needing high peak current capability (1.5 A) and wide voltage tolerance. Consider thermal management via PCB copper areas if operating near maximum power dissipation limits.

Part Context

This part belongs to the TDA2822 series of dual power amplifiers designed for portable consumer electronics. While the standard TDA2822 utilizes a 16-pin Powerdip package, other variants such as the TDA2822D offer the same functionality in an 8-lead SOIC package for surface-mount applications.

Replacement Considerations

The TDA2822D serves as a functional equivalent offering identical electrical performance in an 8-SOIC surface-mount package. Verify pinout compatibility and thermal dissipation requirements when substituting the Powerdip version with the SOIC variant.