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TDA8035HN/C2/S1EL is listed in the Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC INTFACE SPECIALIZED 32HVQFN. Review the specifications below when checking this part for your BOM.
The TDA8035HN/C2/S1EL is a high-integrated, low-power smart card interface IC manufactured by NXP Semiconductors. It serves as the cost-efficient successor to the TDA8024 and complies with EMVCO 4.3 standards. The device operates from a VDDP supply of 2.7 V to 5.5 V and generates regulated card supplies of 5 V, 3 V, or 1.8 V via an internal DC-to-DC converter. Key electrical parameters include a deep shutdown current of 0.1 µA, active mode currents up to 220 mA at 5 V, and a maximum power dissipation of 0.45 W. It features thermal and short-circuit protection, enhanced ESD protection exceeding 8 kV, and supports clock frequencies up to 20 MHz.
Verify that the C2 suffix specifically denotes EMVCO 4.3 compliance, as this distinguishes it from the C1 version. Confirm the S1EL suffix matches the required tape-and-reel packaging format for automated assembly. Ensure the HVQFN32 package dimensions align with the PCB footprint design. Cross-reference the ordering information table in the datasheet to validate the complete part number against manufacturer specifications before finalizing procurement.
Select the TDA8035HN/C2/S1EL when EMVCO 4.3 certification is mandatory for the application. This variant provides the same functional capabilities as the C1 version but meets stricter payment system standards. Consider the low power consumption in Deep Shutdown mode for battery-operated devices. Ensure the host controller can manage the Chip Select (CS) input if multiple interfaces are used in parallel. Verify compatibility with existing ISO 7816 and NDS protocols.
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