ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC AMP CLASS B STEREO 55W 20HSOP
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Type：Class B
- Output Type：2-Channel (Stereo)
- Max Output Power x Channels @ Load：55W x 2 @ 2Ohm
- Voltage - Supply：6V ~ 18V
- Features：Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type：Surface Mount
- Supplier Device Package：20-HSOP
- Package / Case：20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Operating Temperature：-40°C ~ 85°C (TA)
- Grade：-
- Qualification：-
Download product information
Overview
The TDA8566TH/N2C,118 is a stereo power amplifier in a 20-lead HSOP package. It delivers 2 × 40 W into 2 Ω or 2 × 25 W into 4 Ω loads using Bridge-Tied Load configuration. Operating voltage ranges from 6 V to 18 V with typical quiescent current of 115 mA. The device features differential inputs, fixed gain of 26 dB, and open-collector diagnostic outputs for clip detection and short-circuit/temperature warnings.
Feature Summary
- Stereo BTL output stage delivering high power into low impedance loads
- Differential input stage providing high common mode rejection ratio
- Integrated diagnostic facility including clip detection and thermal protection
- Mode select switch enabling operating, mute, and standby states
Applications
- Car radio power amplification
- Automotive audio systems
- Bridge-tied load speaker driving
Procurement Notes
Verify the specific ordering suffix matches the required package variant. Confirm that the component is sourced from authorized NXP distributors to ensure authenticity. Check the latest datasheet revision for any updates to electrical characteristics or pin configurations before finalizing procurement specifications.
Selection Notes
Select this component for applications requiring high efficiency and robust protection in automotive environments. Ensure the PCB layout accommodates the heatsink requirements for the HSOP package. Verify that the supply voltage and load impedance align with the specified power output ratings to maintain performance and reliability standards.
Part Context
This part belongs to the TDA8566 family of class-B output amplifiers designed primarily for car radio applications. The TH variant specifically utilizes a 20-lead small outline plastic package with a heatsink tab. It offers pin compatibility considerations within the broader product line while maintaining distinct electrical characteristics optimized for automotive audio demands.
Replacement Considerations
The TDA8566TH1 is a 24-lead pin-compatible alternative. Designers must verify board layout compatibility when substituting between these variants due to the difference in lead count and package dimensions.
