TDA8924TH/N2,118

Overview

The TDA8924TH/N1,118 is a two-channel Class-D audio power amplifier manufactured by NXP Semiconductors. It operates within a supply voltage range of ±12.5 V to ±30 V and delivers high output power with approximately 90% efficiency. The device supports stereo single-ended or mono bridge-tied load configurations. Key electrical parameters include a typical quiescent current of 100 mA, an internal oscillator frequency of approximately 350 kHz, and fixed gains of 28 dB in SE mode and 34 dB in BTL mode. It features differential inputs, short-circuit protection, and thermal shutdown.

Feature Summary

• High efficiency class-D architecture with very low quiescent current consumption.
• Configurable as stereo single-ended or mono bridge-tied load amplifier.
• Integrated protections including over-temperature, short-circuit, and start-up safety tests.
• Differential audio inputs for high common-mode rejection and flexible application design.

Applications

• Television sets
• Home-sound systems
• Multimedia systems
• Mains-fed audio equipment
• Car audio boosters

Procurement Notes

Verify the specific ordering suffix (N1,118) against the manufacturer's latest documentation to confirm package type and environmental compliance status. Confirm availability as this component may be subject to discontinuation or lifecycle changes. Ensure the supplier provides valid traceability and authenticity guarantees for integrated circuits.

Selection Notes

Select this amplifier for applications requiring high output power with minimal heat dissipation due to its Class-D topology. Consider the HSOP24 package for thermal management requirements. Evaluate the need for external heatsinks based on the specific ambient temperature and load impedance conditions defined in the datasheet derating curves.

Part Context

The TDA8924 belongs to NXP's family of high-power Class-D audio amplifiers designed for mains-fed applications. It utilizes D-MOS technology for high efficiency and includes integrated drivers and timing logic. The device is housed in a thermal-enhanced small outline package suitable for surface mount assembly.

Replacement Considerations

Consult official NXP documentation for verified pin-compatible or functionally equivalent alternatives. Cross-reference specifications such as supply voltage range, output power capabilities, and package dimensions before substitution.