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The TDA8950J/N1,112 is a high-efficiency Class D audio power amplifier manufactured by NXP Semiconductors. It operates within a symmetrical supply voltage range of ±12.5 V to ±40 V and features low quiescent current consumption. The device supports stereo Single-Ended (SE) or mono Bridge-Tied Load (BTL) configurations with full differential inputs. Typical output power reaches 2 × 150 W at 4 Ω in SE mode and 300 W at 8 Ω in BTL mode. It includes advanced protection strategies such as thermal foldback, overcurrent limiting, and short-circuit proofing.
Verify the specific package variant required, as the TDA8950 series includes both HSOP24 and DBS23P options. Confirm that the ordering suffix matches the desired physical footprint and lead configuration. Ensure compatibility with existing PCB layouts designed for pin-compatible predecessors like the TDA8920B if applicable.
Select this component for applications requiring high efficiency and robust protection in compact audio designs. The fixed gain settings of 30 dB in SE and 36 dB in BTL simplify circuit design. Consider the thermal resistance characteristics when designing heatsinking solutions for high-power continuous operation scenarios.
This part belongs to the TDA8950 family of Class D amplifiers. It serves as a direct pin-compatible replacement for the TDA8920B in many existing designs. The J suffix indicates the DBS23P plastic DIL-bent-SIL power package with 23 leads, distinguishing it from the TH variant which uses an HSOP24 package.
TDA8920B
It employs Thermal FoldBack (TFB) to gradually reduce output power when junction temperature exceeds approximately 153 °C. If temperatures continue to rise, OverTemperature Protection (OTP) shuts down the device completely until cooling occurs.
The optimal carrier frequency is between 250 kHz and 450 kHz. Connecting a 30 kΩ resistor between pins OSC and VSSA sets the typical frequency to 345 kHz.