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Product Detailed Parameters
- Description：IC AMPLIFIER DBS37P
- Series：-
- Mfr：NXP USA Inc.
- Package：Tube
- Type：Class AB
- Output Type：4 Half Bridge
- Max Output Power x Channels @ Load：64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
- Voltage - Supply：6V ~ 18V
- Features：-
- Mounting Type：Through Hole
- Supplier Device Package：37-PDBS
- Package / Case：37-SSIP Formed Leads
- Operating Temperature：-40°C ~ 105°C (TA)
- Grade：-
- Qualification：-
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Overview
The TDF8555J/N2,112 is a discontinued quad Bridge-Tied Load (BTL) audio power amplifier manufactured by NXP Semiconductors. It features four half-bridge outputs housed in a 37-pin PDBS package. The device operates as a Class AB amplifier and includes full I²C-bus controlled diagnostics for comprehensive system monitoring and fault detection.
Feature Summary
- Quad BTL architecture with four half-bridge outputs
- Full I²C-bus controlled diagnostics
- Class AB amplification topology
Applications
- Multi-channel audio systems requiring integrated diagnostics
- Professional audio equipment utilizing I²C control interfaces
- High-fidelity sound reinforcement systems
Procurement Notes
This component is officially discontinued and no longer manufactured by NXP Semiconductors. Availability is limited to existing stock from third-party distributors or surplus markets. Verify authenticity and storage conditions carefully when sourcing obsolete inventory. No new production units are available directly from the manufacturer.
Selection Notes
Engineers should consider this part only for legacy system maintenance or repair where specific form-factor and diagnostic integration are required. New designs must select current NXP audio amplifier alternatives that offer active manufacturing support, updated efficiency metrics, and ongoing supply chain stability to ensure long-term product viability.
Part Context
The TDF8555J belongs to NXP's specialized audio amplifier family designed for high-performance applications. It integrates precise digital control via I²C alongside robust analog output stages. The 37-pin PDBS package facilitates thermal management and complex routing for multi-channel configurations in dense electronic assemblies.
Replacement Considerations
No direct public substitute part numbers are confirmed for this discontinued model. Designers must evaluate functional equivalents based on channel count, package dimensions, and I²C compatibility. Consult NXP technical documentation for recommended modern replacements within the current audio amplifier portfolio.
