TDF8599ATH/N2/S6,5

TDF8599ATH/N2/S6,5

  • Description:IC AMP D MONO/STEREO 250W 36HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk

SKU:c34af2dd49ad Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP D MONO/STEREO 250W 36HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk
  • Type:Class D
  • Output Type:1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load:250W x 1 @ 2Ohm; 135W x 2 @ 4Ohm
  • Voltage - Supply:8V ~ 35V
  • Features:Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
  • Mounting Type:Surface Mount
  • Supplier Device Package:36-HSOP
  • Package / Case:36-BSSOP (0.433", 11.00mm Width) Exposed Pad
  • Operating Temperature:-
  • Grade:-
  • Qualification:-

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TDF8599ATH/N2/S6,5

Overview

The TDF8599ATH/N2/S6,5 is a dual Bridge-Tied Load (BTL) car audio amplifier from NXP Semiconductors. It utilizes an NDMOST-NDMOST output stage based on SOI BCDMOS technology to deliver high efficiency in a Class-D configuration. The device supports I2C-bus control for system integration and includes load diagnostics. It is designed to operate with reduced heat sink requirements compared to standard Class-AB amplifiers due to low power dissipation characteristics.

Feature Summary

  • Dual-channel Class-D architecture with integrated NDMOST-NDMOST output stage
  • I2C-bus controlled interface for digital configuration and monitoring
  • Built-in load diagnostics for system reliability
  • High-efficiency operation enabling compact thermal management

Applications

  • In-car audio systems
  • Connected radio infotainment platforms
  • Automotive amplifier modules

Procurement Notes

Verify the exact suffix against official NXP documentation, as distributor listings may vary. Confirm availability status, as some variants are marked as Last Buy or End-of-Life. Ensure the specific package type matches the design requirements before ordering.

Selection Notes

Select this component for automotive applications requiring high power density and digital control. The SOI BCDMOS technology offers advantages in thermal performance. Verify compatibility with the target vehicle's I2C bus voltage levels and ensure adequate PCB layout for the HSOP-36 package.

Part Context

This part belongs to the TDF8599 series of high-power audio amplifiers. It is commonly paired with NXP microprocessors like the i.MX 6 series and radio chipsets such as the SAF9000 in scalable automotive infotainment solutions. The series targets modern connected car environments requiring robust audio processing.

Replacement Considerations

Check for direct pin-compatible upgrades within the TDF8599 family. Verify if newer revisions have replaced the specific S6,5 suffix variant. Consult NXP for obsolescence notices regarding this specific packaging option.

TDF8599ATH/N2/S6,5TDF8599ATH/N2/S6,5

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