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TDP158RSBR is listed in the Specialized range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INTERFACE SPECIALIZED 40WQFN. Review the specifications below when checking this part for your BOM.
The TDP158RSBR is a display interface integrated circuit manufactured by Texas Instruments, designed as a TMDS redriver. It supports data rates up to 6 Gbps and operates with a maximum frequency of 340 MHz. The device accepts AC-coupled HDMI signals and converts them to TMDS format for transmission. It functions within a supply voltage range of 1 V to 3.6 V, utilizing typical operating voltages of 1.1 V and 3.3 V. The component draws a working power current of 45 mA and is housed in a WQFN-40 package suitable for surface mount technology. It supports I2C interface control and features differential outputs.
Verify the specific suffix 'R' indicates reel packaging when ordering. Confirm RoHS compliance status through official documentation. Ensure the WQFN-40 package dimensions match the target PCB layout. Check humidity sensitivity handling requirements during storage and assembly. Validate that the 1.1 V and 3.3 V supply rails are compatible with the system design.
Select this component for applications requiring TMDS signal regeneration from AC-coupled sources. Ensure the design accommodates the 45 mA operating current and 3.6 V maximum supply voltage. Verify compatibility with I2C control lines if configuration is required. Consider the WQFN-40 package size for board space constraints. Confirm operation within the specified 0°C to +85°C temperature range.
The TDP158RSBR belongs to the TDP158 series of display interface ICs from Texas Instruments. This series focuses on TMDS redriver functionality for high-definition video applications. The RSBR variant specifically denotes the reel packaging option within the WQFN-40 form factor. It complements other interface solutions by providing signal integrity maintenance for HDMI-based systems.
The TDP158RSBT is a pin-compatible alternative offered in cut-tape packaging. Verify that the functional specifications remain identical before substitution. Ensure the packaging difference does not impact automated assembly processes. Confirm availability and lead times for both variants.
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