TE0600-03-52I11-C

TE0600-03-52I11-C

  • Description:IC MODULE GIGABEE
  • Series:-

SKU:38ba7749feef Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE GIGABEE
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Spartan-6 LX-45
  • Co-Processor:-
  • Speed:125MHz
  • Flash Size:16MB
  • RAM Size:256MB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0600-03-52I11-C

Overview

The TE0600-03-52I11-C is an industrial-grade Xilinx Spartan-6 LX FPGA micromodule manufactured by Trenz Electronic. It integrates a Spartan-6 LX FPGA, a Marvell Alaska Ethernet PHY (88E1111), two 16-bit DDR3 SDRAM chips (totaling 128 MB or 512 MB), and 16 MB SPI Flash memory. The module features on-board switching regulators providing 4.0 A at 1.2 V and 1.5 A at 1.5 V. Communication with the carrier board occurs via two 100-pin hermaphroditic B2B connectors, exposing up to 52 differential and 109 single-ended I/O pins.

Feature Summary

  • Industrial-grade Xilinx Spartan-6 LX FPGA with eFUSE encryption support
  • Integrated 10/100/1000 Mbps Ethernet PHY (Marvell 88E1111)
  • Dual 16-bit DDR3 SDRAM banks (128 MB or 512 MB total capacity)
  • On-board power management with 4.0 A @ 1.2V and 1.5 A @ 1.5V rails

Applications

  • High-speed data acquisition systems requiring FPGA processing
  • Industrial communication gateways utilizing Gigabit Ethernet
  • Embedded control units with high-bandwidth memory requirements

Procurement Notes

Verify the specific FPGA density (LX45, LX100, or LX150) and DDR3 capacity (128 MB vs 512 MB) associated with the suffix, as these define the hardware resources. Confirm the operating temperature range matches the 'I' designation for industrial applications. Ensure the carrier board supports the required 3.3 V nominal supply voltage within the 3.0 V to 3.45 V tolerance.

Selection Notes

Select this module when an industrial-rated Spartan-6 solution with integrated networking and memory is required. The 1.2 V rail supports up to 4.0 A, suitable for high-performance FPGA designs. Verify that the carrier board provides adequate cooling, as power consumption varies significantly based on the implemented logic design and clock speeds.

Part Context

This part belongs to the Trenz Electronic GigaBee XC6SLX series of micromodules. These modules are designed to plug into compatible carrier boards, such as the TE0603, to accelerate development cycles. The series offers various FPGA densities and memory configurations to balance cost and performance for embedded applications.

Replacement Considerations

No direct public substitutes are documented. Consider newer Xilinx Artix-7 or Kintex-7 based modules from Trenz Electronic or other vendors if Spartan-6 availability is constrained. Ensure pin compatibility and software migration efforts are evaluated before switching families.

TE0600-03-52I11-CTE0600-03-52I11-C

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