TE0713-02-200-2C

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0713-02-200-2C is a 4 x 5 cm industrial-grade FPGA module featuring the Xilinx Artix-7 XC7A200T-2FBG484C. It integrates 1 GByte of DDR3L SDRAM, 32 MByte QSPI Flash with XiP support, and a USB 3.0 to FIFO bridge. The module includes four GTP transceiver lanes, a programmable clock quad generator, and on-board DC-DC converters for power management. I/Os are accessed via rugged high-speed strips, providing 152 FPGA I/Os and 75 differential pairs through B2B connectors.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Artix-7 XC7A200T-2FBG484C FPGA with 4 GTP lanes
• 1 GByte DDR3L 32-bit SDRAM and 32 MByte QSPI Flash
• USB 3.0 to FIFO interface bridge
• Plug-on design with 2x100-pin and 1x60-pin hermaphroditic strips

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation systems requiring high shock resistance
• Data acquisition modules utilizing USB 3.0 FIFO connectivity
• Embedded processing units with DDR3L memory requirements
• Prototyping platforms for Xilinx Artix-7 designs

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's documentation to ensure correct component revisions. Confirm that the commercial temperature range (0°C to +70°C) meets project thermal requirements, as industrial ranges may require special requests. Check for availability of assembly options if cost or performance optimization is needed for high-volume production.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact 4 x 5 cm form factor is required alongside significant memory resources. The inclusion of a USB 3.0 bridge facilitates rapid data transfer and debugging. Ensure the carrier board supports the specified 2x100-pin and 1x60-pin connector layout. Consider the eFUSE and AES encryption features if security requirements mandate bit-stream protection.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the Trenz Electronic Micromodul family, designed for mechanical and electrical compatibility within its size class. It utilizes standard high-speed strip connectors common to the series. The product is manufactured in Germany and is intended for integration into custom carrier boards rather than standalone use.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Modules within the same 4 x 5 cm form factor from Trenz Electronic offer mechanical compatibility. Verify electrical pinout alignment before substituting. No direct cross-brand substitutes are confirmed in the provided documentation.