TE0715-04-21C33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-21C33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z030 variant. It integrates a dual-core ARM Cortex-A9 processor with 1GB of 32-bit wide DDR3L SDRAM and 32MB of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY, a Microchip USB3320 high-speed ULPI transceiver, and a Lattice MachXO2 CPLD for system management. Connectivity is provided via three rugged Samtec Razor Beam connectors offering 132 FPGA I/Os, 14 PS MIO pins, and four GTP/GTX transceiver lanes.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Industrial-grade Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 cores
• 1GB DDR3L SDRAM and 32MB Quad SPI Flash memory
• Integrated Gigabit Ethernet PHY (Marvell 88E1512) and USB 2.0 ULPI PHY (Microchip USB3320)
• Four GTX transceiver lanes with dedicated clock inputs
• System Controller CPLD (Lattice MachXO2) for power monitoring and configuration

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring rugged performance
• Embedded vision and multimedia processing applications
• High-speed data acquisition and communication interfaces
• Custom carrier board development for Zynq-based prototypes

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the specific ordering suffix matches the required SoC speed grade and temperature range. Confirm baseboard compatibility regarding voltage levels for HP banks on the -30 variant. Ensure the carrier board provides the necessary AC coupling capacitors for the MGT reference clocks as specified in the technical manual.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this model when the XC7Z030 resource density is required over the smaller XC7Z015. Note that banks 34 and 35 operate as High Performance (HP) banks with a maximum voltage tolerance of 1.8V on the -30 variant, unlike the HR banks on the -15 version. Ensure the design utilizes the available 132 FPGA I/Os and four transceiver lanes effectively.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the TE0715 family, which supports both XC7Z015 and XC7Z030 processors. The TE0715-04-21C33-A specifically denotes the XC7Z030 processor variant. It shares the same mechanical form factor and peripheral layout as other TE0715 modules, allowing for potential pin-compatible upgrades or downgrades within the family depending on resource needs.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

The TE0715-04-21C11-A serves as a direct replacement if the lower-resource XC7Z015 processor is sufficient for the application. Both modules share identical mechanical dimensions and connector layouts, ensuring physical compatibility with existing carrier boards designed for the TE0715 series.