TE0715-04-51I33-L

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-51I33-L is an industrial-grade System-on-Module (SoM) based on the AMD Xilinx Zynq-7000 SoC, specifically the XC7Z030 variant. It integrates 1 GByte of 32-bit wide DDR3L SDRAM and 32 MBytes of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver. Power management is handled by on-board switching-mode DC-DC converters, including dedicated rails for 1.0V, 1.5V, and 1.8V loads. Connectivity is provided via rugged Samtec Razor Beam™ high-speed stacking strips.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Industrial-grade AMD Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 processors
• 1 GByte 32-bit DDR3L SDRAM and 32 MByte Quad SPI Flash memory
• Integrated Marvell Alaska 88E1512 Gigabit Ethernet PHY and Microchip USB3320 ULPI PHY
• Four GTX high-performance transceiver lanes with programmable clock generator

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring programmable logic
• Embedded networking applications utilizing Gigabit Ethernet connectivity
• Portable devices requiring USB host/device functionality and real-time clock capabilities

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the specific ordering suffix corresponds to the required processor speed grade and temperature range. Confirm baseboard compatibility regarding B2B connector mating heights and voltage levels, particularly for HP banks on the XC7Z030 variant which are limited to 1.8V. Ensure power supply specifications meet the minimum current requirements for system startup.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when high-performance processing combined with FPGA flexibility is required in an industrial environment. The XC7Z030 offers more logic resources than the XC7Z015. Consider the integrated peripherals such as the RTC and Ethernet PHY if external components are undesirable. Verify carrier board design supports the specific I/O bank voltage constraints of the HP banks.

Microcontrollers, Microprocessor, FPGA Modules Part Context

The TE0715 series comprises various variants based on the Zynq-7000 family, including the XC7Z015 and XC7Z030. The TE0715-04-51I33-L denotes the specific configuration with the XC7Z030 processor, industrial temperature rating, and specific memory/peripheral options. It belongs to the 4x5 cm form factor module line designed for rugged applications.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements within the same form factor include other TE0715 variants using different Zynq-7000 chips like the XC7Z015. Cross-family migration to newer Xilinx architectures requires significant hardware redesign due to pinout and interface differences.