TE0715-04-52I33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-52I33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z030 variant. It integrates 1 GB of 32-bit wide DDR3L SDRAM and 32 MByte of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver. Power management includes high-efficiency DC-DC converters providing dedicated rails for the processor core and I/O banks. Connectivity is established via rugged Samtec Razor Beam™ high-speed stacking strips.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq-7000 XC7Z030 SoC with dual ARM Cortex-A9 processors
• 1 GB DDR3L SDRAM and 32 MB Quad SPI Flash memory
• Marvell 88E1512 Gigabit Ethernet PHY with RGMII and SGMII support
• Microchip USB3320 High-Speed USB 2.0 ULPI PHY
• System Controller CPLD (Lattice MachXO2) for power and status monitoring

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers requiring robust FPGA processing
• Embedded systems utilizing Gigabit Ethernet connectivity
• Portable devices requiring USB host/device capabilities
• Data acquisition systems leveraging Zynq PS/PL architecture

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and revision status. Ensure carrier board designs account for the voltage constraints of the HP banks on the -xx-30 variants. Confirm that the required boot mode (QSPI or SD Card) aligns with the baseboard hardware configuration.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this model when the XC7Z030 logic density and processing performance are required over the smaller XC7Z015. Note that banks 34 and 35 operate as High Performance (HP) banks on this variant, limiting I/O voltage levels to 1.8V maximum. Verify that the carrier board provides the necessary 3A startup current capability and supports the specific B2B connector mating heights.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the Trenz Electronic TE0715 family, designed for the Xilinx Zynq-7000 series. It shares the same mechanical footprint and peripheral layout as other variants in the series, such as those based on the XC7Z015, allowing for scalable design transitions within the same hardware platform while differing in internal FPGA resources.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements within the TE0715 family include the TE0715-04-52I13-A (XC7Z015 variant). Cross-family migration to newer Xilinx architectures requires significant carrier board redesign due to pinout and interface differences.