TE0720-03-2IF

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0720-03-2IF is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq-7000 All Programmable SoC, specifically the XC7Z020 chip operating at the industrial temperature grade (-40°C to +85°C). The module provides dual-core ARM Cortex-A9 processing capabilities alongside reconfigurable FPGA logic resources. Memory configurations typically include DDR3 SDRAM and non-volatile storage such as e.MMC, enabling standalone operation. The hardware architecture supports high-speed data acquisition and digital signal processing tasks within a compact form factor suitable for space-constrained industrial environments.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Integrates Xilinx Zynq-7000 All Programmable SoC combining ARM processors with FPGA fabric
• Supports industrial temperature range operation for harsh environment reliability
• Provides modular system-on-module architecture for rapid prototyping and deployment
• Includes integrated memory interfaces for SDRAM and flash storage connectivity

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring programmable logic
• Embedded data acquisition and signal processing platforms
• Custom hardware development using Simulink and Embedded Coder workflows
• Space-constrained IoT edge devices needing combined CPU/FPGA capabilities

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm specific revision levels and manufacturing dates against current production notices. Ensure compatibility with carrier boards regarding pinout definitions and power requirements. Check for any product change notifications that may affect mechanical dimensions or electrical characteristics prior to final design integration.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when both hard processor system performance and flexible FPGA logic are required in a single package. Consider the specific I/O count and memory capacity needs of the target application. Evaluate thermal management solutions suitable for the industrial temperature range. Compare against standard FPGA-only modules if processing power is secondary to logic density.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0720 series of System-on-Modules from Trenz Electronic, which focuses on Xilinx Zynq-7000 devices. The series offers various memory and storage configurations tailored for different computational loads. These modules serve as core components for developing complex embedded systems that benefit from the hybrid nature of ARM processors and programmable logic.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Check for updated revisions within the same TE0720 family offering improved memory speeds or storage capacities. Verify mechanical footprint compatibility if replacing with other Zynq-7000 based SOMs from different vendors. Ensure software toolchain support remains consistent for migration purposes.