TE0720-03-61Q33FA

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-61Q33FA is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z020 variant. It integrates a dual-core ARM Cortex-A9 processing system and an Artix-7 FPGA fabric with 85K logic cells. The module includes up to 1 GB of DDR3/L SDRAM, 32 MB Quad SPI Flash, and an eMMC NAND Flash interface. Connectivity features include a Gigabit Ethernet PHY (Marvell 88E1512), a high-speed USB 2.0 ULPI transceiver (Microchip USB3320C-EZK), and multiple I/O banks accessible via rugged Samtec LSHM stacking connectors.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq-7000 SoC (XC7Z020) with Dual-core ARM Cortex-A9 PS and 85K PL Logic Cells
• Up to 1 GB DDR3/L SDRAM and 32 MB Quad SPI Flash memory
• Integrated Marvell 88E1512 Gigabit Ethernet PHY and Microchip USB3320C-EZK ULPI PHY
• System Controller CPLD (Lattice LCMXO2-1200HC) for power management and peripheral control

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring robust processing
• Embedded vision and signal processing applications utilizing the Artix-7 FPGA
• Networked IoT gateways leveraging integrated Gigabit Ethernet and USB interfaces

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the specific ordering suffix corresponds to the desired memory configuration and component variants. Confirm carrier board compatibility regarding power sequencing signals such as NOSEQ and PGOOD. Ensure the design accounts for the required 3A startup current capability and proper termination of unused I/O banks.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a combination of ARM processing and programmable logic is required in an industrial environment. The TE0720-03-61Q33FA provides extensive I/O through three B2B connectors. Consider the optional eCompass module if sensor fusion is needed. Verify that the carrier board supports the specific voltage levels (1.8V/3.3V) for the MIO and HR banks.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0720 family of modules from Trenz Electronic, designed around the Xilinx Zynq-7000 series. The '03' indicates the hardware revision or form factor, while '61Q33FA' specifies the exact SoC variant, memory size, and connector configuration. These modules are intended for integration into custom carrier boards for embedded applications.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct pin-to-pin replacements are not available due to the proprietary module form factor and specific B2B connector layout. Alternative solutions require redesigning the carrier board interface. Evaluate other Trenz Electronic modules based on the Zynq-7000 family if different performance or memory configurations are required.