TE0720-03-61Q33ML

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-61Q33ML is an industrial-grade System on Module (SoM) based on the Xilinx Zynq XC7Z020 SoC. It integrates a dual-core ARM Cortex-A9 MPCore processing system and an Artix-7 FPGA with 85K logic cells. The module features up to 1 GB of DDR3/L SDRAM, 32 MB of Quad SPI flash memory, and supports up to 32 GB of eMMC storage. Connectivity includes a Gigabit Ethernet PHY (Marvell 88E1512), USB 2.0 ULPI transceiver, and I2C interfaces for peripherals such as an RTC and optional eCompass.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq XC7Z020 SoC with dual-core ARM Cortex-A9 and 85K Artix-7 PL cells
• Up to 1 GB DDR3/L SDRAM and 32 MB QSPI Flash
• Integrated Marvell 88E1512 Gigabit Ethernet PHY and Microchip USB3320C ULPI PHY
• System Controller CPLD (Lattice LCMXO2-1200HC) for power management and peripheral control

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems
• Embedded computing platforms requiring high I/O density
• Secure embedded applications utilizing Atmel ATSHA204A crypto-authentication

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and exact component configuration. As this is a specialized industrial module, lead times may vary significantly from standard consumer components. Confirm that the carrier board design accommodates the required 3.3V power input and B2B connector mating heights before procurement.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this variant if the application requires the higher performance of the XC7Z020 over the single-core XC7Z014S. Ensure the carrier board provides the necessary 3A startup current capability. Verify that the required storage capacity (eMMC vs. QSPI) aligns with the specific sub-model options available, as eMMC size varies by assembly option.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the TE0720 family, designed for rugged environments using Samtec Razor Beam connectors. It shares the same form factor and core architecture with variants like the TE0720-03-62I33GA, differing primarily in the specific SoC speed grade, memory configuration, and included peripherals.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Due to the proprietary integration of the System Controller CPLD firmware and specific B2B connector pinouts, direct pin-to-pin replacements from other manufacturers are unlikely without significant carrier board redesign.