TE0745-01-30-1I

TE0745-01-30-1I

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745

SKU:52e1a7ed9f1b Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq-7000 (Z-7030)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec UFPS
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0745-01-30-1I

Overview

The TE0745-01-30-1I is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, designed for industrial applications. It integrates the AMD Xilinx Zynq XC7Z030 FPGA with an ARM Cortex-A9 processor core. The module features 1 GB of DDR3L memory and 32 MB of flash storage. Its physical dimensions are 52 mm x 76 mm, operating within a temperature range of -40°C to 85°C. Connectivity is provided via Samtec UFPS connectors.

Feature Summary

  • Integrates Xilinx Zynq SoC architecture combining programmable logic and dual-core ARM Cortex-A9 processors
  • Supports industrial-grade wide temperature operation from -40°C to 85°C
  • Utilizes Samtec UFPS connector interface for reliable high-density interconnectivity

Applications

  • Industrial automation control systems
  • Embedded vision processing units
  • Portable medical instrumentation
  • Ruggedized communication infrastructure

Procurement Notes

Verify component availability status directly with authorized distributors or the manufacturer, as supply conditions for embedded components fluctuate. Confirm that the specific ordering suffix matches the required pinout and configuration. Ensure compatibility with carrier board designs utilizing Samtec UFPS interfaces before finalizing procurement orders.

Selection Notes

Select this module when a compact solution requiring both FPGA flexibility and ARM processing power is needed. It is suitable for designs constrained by the 52x76mm form factor. Consider the integrated 1GB DDR3L and 32MB flash capacity against application data throughput requirements. Validate thermal management strategies for the specified industrial temperature range.

Part Context

This part belongs to the TE0745 family of modular systems based on the AMD Xilinx Zynq-7000 series. These modules provide a standardized hardware platform for developers, reducing time-to-market for complex embedded projects. The family includes variants with different FPGA capacities and memory configurations to suit diverse performance needs.

Replacement Considerations

Direct substitutes include other TE0745 variants such as TE0745-03-91C31-A for higher performance requirements. Cross-vendor replacements require significant redesign due to proprietary connector and firmware dependencies.

TE0745-01-30-1ITE0745-01-30-1I

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