TE0745-02-30-1I

TE0745-02-30-1I

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745

SKU:54eb64da6621 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq-7000 (Z-7030)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec UFPS
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

Download product information

TE0745-02-30-1I

Overview

The TE0745-02-30-1I is a System-on-Module manufactured by Trenz Electronic, integrating an AMD Zynq XC7Z030-1FBG676I processor. It features 1 GByte of DDR3L SDRAM and 64 MB of flash memory. The module operates within a temperature range of -40°C to +85°C and measures 52 mm x 76 mm.

Feature Summary

  • Integrates AMD Zynq 7030 SoC with ARM Cortex-A9 processors
  • Includes onboard 1 GB DDR3L memory and 64 MB flash storage
  • Designed for industrial environments with extended temperature support

Applications

  • Industrial automation control systems
  • Embedded data acquisition platforms
  • High-precision measurement instrumentation

Procurement Notes

Verify component availability status as this specific model may be subject to discontinuation or limited supply conditions. Confirm current manufacturing lifecycle stage and lead times with authorized distributors before finalizing procurement plans.

Selection Notes

Select this module for applications requiring the specific performance profile of the Zynq 7030 processor. Ensure mechanical compatibility with carrier boards supporting the 52x76 mm footprint and verify power requirements align with system design constraints.

Part Context

This module belongs to the TE0745 family from Trenz Electronic, designed for embedded solutions based on Xilinx/AMD Zynq architectures. It serves as a compact computing core for custom carrier board designs in professional engineering contexts.

TE0745-02-30-1ITE0745-02-30-1I

Click on the inquiry