TE0745-02-71I11-A

Overview

The TE0745-02-71I11-A is a System-on-Module (SoM) manufactured by Trenz Electronic, integrating an AMD Zynq-7000 series processor. This specific variant utilizes the XC7Z010-1FBG484I chip, which features dual ARM Cortex-A9 cores and programmable logic fabric. The module includes 512 MByte of DDR3L SDRAM for system memory and 64 MByte of flash storage. It operates within an industrial temperature range of -40°C to +85°C and adheres to RoHS compliance standards.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processing units
• Includes onboard 512 MByte DDR3L SDRAM and 64 MByte flash memory
• Designed for industrial environments with extended temperature operation capabilities
• Provides I2C interface connectivity for peripheral integration

Applications

• Industrial automation and control systems requiring embedded processing
• High-speed data acquisition applications utilizing FPGA capabilities
• Precision measurement systems based on mixed-signal programmable logic
• Embedded digital signal processing solutions in harsh environments

Procurement Notes

Verify the exact part number suffix against official Trenz Electronic documentation to ensure correct processor speed grade and memory configuration. Confirm that the required operating temperature range aligns with the industrial specification (-40°C to +85°C). Check for any specific revision differences in the silicon stepping or board layout that may affect mechanical fit or electrical performance in your design.

Selection Notes

Select this module when a compact form factor is required alongside significant programmable logic resources. Compare the XC7Z010 resource availability against higher-end Zynq models if additional processing power or logic capacity is needed. Ensure the carrier board design supports the FBG484 package pinout and provides adequate thermal management for continuous industrial operation.

Part Context

This component belongs to the Trenz Electronic TE0745 family of modular systems designed around Xilinx/AMD Zynq devices. These modules are engineered to accelerate development cycles by providing pre-validated hardware platforms. The family typically offers various form factors and memory configurations to suit different application constraints while maintaining compatibility with standard carrier board designs.