TE0745-02-71I11-AK

Overview

The Trenz Electronic TE0745-02-71I11-AK is a System on Module integrating an AMD Zynq XC7Z030 SoC with dual-core ARM Cortex-A9 processors. It features 1 GByte of DDR3L SDRAM and 64 MByte of Quad SPI Flash memory. The module provides 250 FPGA PL I/Os, four GTX transceiver lanes, and a Gigabit Ethernet PHY. It operates within an industrial temperature range and utilizes three high-speed stacking connectors for board-to-board interfacing.

Feature Summary

• Integrates Xilinx Zynq XC7Z030 SoC with dual-core ARM Cortex-A9 MPCore
• Includes 1 GByte DDR3L SDRAM and 64 MByte QSPI Flash for configuration
• Features a programmable quad PLL clock generator and temperature-compensated RTC
• Supports eFUSE bit-stream encryption and AES security features

Applications

• Industrial automation controllers requiring rugged performance
• Medical imaging systems needing secure data processing
• Aerospace and defense avionics platforms
• High-performance embedded networking equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product matrix to ensure compatibility with required processor variants and memory configurations. Confirm that the delivery state matches project requirements, as initial units may have unprogrammed EEPROM or flash arrays. Cross-reference the hardware revision number printed on the module with the technical reference manual to validate pin assignments and signal integrity specifications.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA logic resources and hard processor system capabilities. The TE0745 series supports multiple Zynq variants; verify that the XC7Z030 variant meets the specific gate count and transceiver lane requirements for the target application. Consider the available B2B connector density and voltage levels when designing the carrier board interface.

Part Context

This component belongs to the TE0745 family of modular systems designed by Trenz Electronic. These modules are engineered to simplify the integration of Xilinx Zynq SoCs into custom carrier boards. The family offers various memory and processor combinations, providing a standardized interface for rapid prototyping and production deployment in demanding environments.

Replacement Considerations

Publicly confirmed substitutes include other variants within the TE0745 series, such as those equipped with XC7Z035 or XC7Z045 processors, provided the pinout and resource requirements align. Direct replacements from other manufacturers require careful evaluation of the mechanical footprint, connector definitions, and power distribution network compatibility.