TE0745-02-92I11-F

Overview

The TE0745-02-92I11-F is a System on Module integrating an industrial-grade Xilinx Zynq XC7Z030 SoC, 1 GByte DDR3L SDRAM, and 64 MByte Quad SPI Flash. It features dual-core ARM Cortex-A9 processors, four GTX transceiver lanes, and a Gigabit Ethernet PHY. The module utilizes three 160-pin high-speed stacking connectors for Board-to-Board interfacing, supporting up to 250 FPGA PL I/Os with LVDS capability.

Feature Summary

• Industrial-grade Xilinx Zynq XC7Z030 SoC with dual-core ARM Cortex-A9 MPCore
• Integrated 1 GByte DDR3L SDRAM and 64 MByte QSPI Flash memory
• Four GTX transceiver lanes and Gigabit Ethernet PHY
• System Controller CPLD for centralized management and boot configuration

Applications

• Industrial automation controllers requiring robust processing
• Medical imaging systems needing reliable data acquisition
• Aerospace and defense avionics platforms
• Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current variant list to ensure compatibility with required temperature grades and memory configurations. Confirm that the baseboard design supports the 12V power supply requirement and matches the pinout of the three 160-pin B2B connectors. Check for any mandatory assembly options requested during procurement.

Selection Notes

Select this module when an industrial-grade Zynq 7000 SoC is required with integrated high-speed serial transceivers and Ethernet connectivity. Ensure the application benefits from the onboard system controller CPLD for simplified boot management. Verify that the 1 GByte DDR3L capacity and 64 MByte flash storage meet the firmware and runtime data requirements.

Part Context

This part belongs to the Trenz Electronic TE0745 family of modular systems designed for the Xilinx Zynq 7000 series. These modules provide a compact form factor (5.2 x 7.6 cm) that simplifies integration into carrier boards. The TE0745 series supports various Zynq variants, offering flexibility in processing performance and I/O density while maintaining a consistent mechanical and electrical interface.

Replacement Considerations

Direct replacements within the same form factor are limited to other TE0745 variants using different Zynq chips (e.g., XC7Z035 or XC7Z045). Cross-family replacement requires significant baseboard redesign due to connector and pinout differences.