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The Trenz Electronic TE0745-02-93E31-A is a System-on-Module integrating an AMD Zynq XC7Z-030 SoC, 1 GByte DDR3L SDRAM, and 64 MByte QSPI Flash. It features dual-core ARM Cortex-A9 processors, 250 FPGA PL I/Os, four GTX transceiver lanes, and a Gigabit Ethernet PHY. The module utilizes rugged board-to-board stacking connectors for high-speed I/O access and includes on-board power management with switch-mode DC-DC converters.
Verify the specific ordering suffix against the manufacturer's current product matrix to confirm component revisions and availability status. Confirm that the baseboard design supports the required 12V supply input and matches the pinout of the three 160-pin high-speed stacking connectors. Ensure thermal management solutions are adequate for the intended operating environment.
Select this module when a compact form factor is required alongside significant programmable logic resources and processing power. The inclusion of onboard peripherals such as Ethernet, USB, and RTC reduces baseboard complexity. Consider the available GTX lanes for high-speed serial communication requirements and verify compatibility with existing Linux or bare-metal software development environments.
This module belongs to the TE0745 family of System-on-Modules designed by Trenz Electronic. These modules are engineered to simplify the integration of Xilinx Zynq SoCs into custom carrier boards. The TE0745 series provides a standardized interface for rapid prototyping and production deployment in demanding industrial applications.
Consult the official Trenz Electronic discontinuation notices for legacy variants within the TE0745 series. Verify functional equivalence if substituting with other Zynq-based modules from different manufacturers, ensuring mechanical footprint and connector pinouts are compatible.