TE0745-03-71I31-A

Overview

The TE0745-03-71I31-A is a System-on-Module utilizing the AMD Zynq XC7Z030-1FBG676i SoC. It integrates 1 GB of DDR3L memory and 64 MB of flash storage. The module operates within an industrial temperature range of -40°C to +85°C. Key interfaces include Gigabit Ethernet, USB OTG, I2C, JTAG, and multiple high-speed MGT GTX lanes.

Feature Summary

• Dual-bank High-Speed IO configuration supporting flexible voltage levels
• Integrated Real-Time Clock with battery backup support
• Onboard CPLD for system management and boot control
• Supports RGMII Ethernet and ULPI USB connectivity

Applications

• Industrial automation controllers
• Medical imaging systems
• Aerospace avionics
• Telecommunications infrastructure

Procurement Notes

Verify component authenticity through authorized Trenz Electronic distributors. Confirm RoHS compliance status prior to integration. Ensure carrier board design adheres to the provided schematic guidelines for power sequencing and signal integrity. Cross-reference assembly options against specific project requirements.

Selection Notes

Select this module when requiring a compact form factor with dual-core ARM Cortex-A9 processing capabilities. Suitable for designs needing robust industrial environmental tolerance. Consider thermal management solutions if operating at maximum clock frequencies. Verify pin compatibility with existing carrier board layouts.

Part Context

This module belongs to the TE0745 family of modular systems designed by Trenz Electronic. It serves as a core computing unit for embedded applications requiring FPGA programmability alongside processor functionality. The series emphasizes modularity and ease of integration into custom carrier designs.

Replacement Considerations

No public confirmed substitutes are available in the provided documentation. Direct replacement requires validation of mechanical footprint and electrical interface compatibility.