TE0745-03-91C31-A

Overview

The TE0745-03-91C31-A is a System-on-Module utilizing the AMD Kintex-7 XC7Z045 FPGA. It features an integrated ARM Cortex-A9 processor, 256 MB DDR3L memory, and 64 MB flash storage. The module supports high-speed serial connectivity via four GTX transceivers and provides extensive I/O through multiple configurable banks.

Feature Summary

• Integrates an AMD Kintex-7 FPGA with dual-core ARM Cortex-A9 processing system
• Includes onboard DDR3L SDRAM and non-volatile flash memory for standalone operation
• Supports Gigabit Ethernet and USB OTG interfaces for peripheral connectivity
• Provides multiple high-speed differential I/O banks and dedicated clock inputs

Applications

• Industrial automation controllers requiring real-time processing
• High-performance embedded vision systems
• Telecommunications infrastructure equipment
• Medical imaging devices
• Aerospace and defense avionics

Procurement Notes

Verify the specific assembly variant suffix against the latest Trenz Electronic documentation to ensure compatibility with required power rails and interface configurations. Confirm RoHS compliance status and check for any active Product Change Notifications that may affect component sourcing or pin assignments before finalizing procurement plans.

Selection Notes

Select this module when a combination of high-capacity FPGA logic and embedded processing is required in a compact form factor. Ensure carrier board designs support the specified voltage ranges for HR and HP IO banks. Validate thermal management requirements given the power consumption characteristics of the Kintex-7 device family.

Part Context

This part belongs to the TE0745 modular system series designed by Trenz Electronic. These modules are engineered to accelerate development cycles by providing pre-validated hardware platforms based on AMD Zynq and Kintex-7 technologies. They serve as core computing units for custom carrier boards in specialized electronic applications.

Replacement Considerations

No direct public substitutes are confirmed for this specific configuration. Alternative solutions would require redesigning the carrier board and software stack due to differences in FPGA architecture, pinout, and memory controller implementations.