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TE0745-03-93E31-AK is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is SOM WITH AMD ZYNQ 7045-3E AND HE. Review the specifications below when checking this part for your BOM.
The TE0745-03-93E31-AK is a System on Module (SoM) manufactured by Trenz Electronic, designed for industrial and automotive applications. It integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-1FBG676I chip, featuring dual ARM Cortex-A9 processors. The module includes 1 GB of DDR3L SDRAM and 64 MB of flash memory. Operating within a temperature range of -40°C to +85°C, it utilizes a compact form factor measuring 52 mm by 76 mm.
Verify the specific suffix 'AK' against official Trenz Electronic documentation to confirm exact configuration details, as suffixes may indicate specific revisions or accessory inclusions not detailed in general summaries. Ensure compatibility with carrier boards such as the TEF series when designing custom hardware solutions.
Select this module for applications requiring high-performance FPGA logic combined with ARM processing capabilities. The Zynq-7030 variant offers sufficient resources for complex embedded tasks. Consider thermal management requirements given the industrial temperature range and potential heat spreader accessories like the KK0745 series if passive cooling is insufficient.
This component belongs to the TE0745 family of modular systems from Trenz Electronic, which specializes in FPGA and SoC-based embedded solutions. The manufacturer provides comprehensive development support, including ECAD models and library loaders, facilitating integration into custom carrier board designs for industrial and automotive sectors.
Publicly confirmed direct substitutes are not available in the provided source material. Engineers should evaluate other modules within the TE0745 series or comparable Xilinx Zynq-7000 based SoMs from different manufacturers, ensuring pinout and software compatibility with existing carrier board infrastructure.
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