TE0803-03-5DI21-A

Overview

The TE0803-03-5DI21-A is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC. It supports up to 8 GByte of 64-bit DDR4 SDRAM and dual SPI boot Flash memory. The module provides high-speed connectivity via four Board-to-Board connectors with 160 contacts each, exposing MGT lanes, user I/Os, and configuration signals. It features on-board power management for separate Low-Power, Full-Power, and Programmable Logic domains.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with heterogeneous processing system and programmable logic
• Supports up to 8 GByte DDR4 SDRAM and dual parallel SPI Flash for boot configurations
• Includes four rugged high-speed stacking connectors for extensive signal routing
• Features on-board Si5338A programmable PLL clock generator and dedicated power domain control

Applications

• Industrial automation and control systems requiring robust embedded computing
• High-speed data acquisition and processing applications utilizing transceiver lanes
• Complex FPGA-based prototyping and development platforms
• Automotive or aerospace electronics demanding industrial temperature ranges

Procurement Notes

Verify the specific MPSoC variant (e.g., ZU2CG, ZU3EG, ZU4EV) required for your application, as performance and transceiver availability vary by chip selection. Confirm that the carrier board design accommodates the 52 x 76 mm form factor and provides the necessary single 3.3V input source. Ensure compliance with the recommended power-on sequence for the multiple voltage domains during integration.

Selection Notes

Select this module when a compact solution combining ARM processors and FPGA fabric is needed. Choose variants based on the required number of Gigabit Transceivers; ZU4CG and ZU4EV models offer additional GTH lanes compared to ZU2/3 series. Consider the maximum memory requirements for DDR4 and Flash capacity, noting that the module supports up to 8 GByte DDR4 and 512 MByte Flash depending on the assembly version.

Part Context

This component belongs to the Trenz Electronic TE0803 family of System-on-Modules designed around Xilinx Zynq UltraScale+ MPSoCs. These modules are engineered to simplify the integration of complex SoC architectures into custom carrier boards. The family emphasizes industrial reliability, offering comprehensive on-board peripherals and flexible power management within a standardized small form factor.

Replacement Considerations

Direct replacements depend on the specific MPSoC silicon variant installed in the unit. Verify compatibility with existing carrier board designs, particularly regarding the 160-pin B2B connector pitch and pinout assignments. Different MPSoC options within the TE0803 family may have varying transceiver counts and I/O bank configurations.