TE0803-04-5DI21-A

Overview

The TE0803-04-5DI21-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with quad-core ARM Cortex-A53 and dual-core Cortex-R5 processors. The module features integrated LPDDR4 memory and extensive I/O interfaces, including PCIe, USB 3.0, Gigabit Ethernet, and DisplayPort. Engineered for industrial environments, it supports an extended operating temperature range from -40°C to +85°C, ensuring reliability in demanding conditions.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 cores
• Supports extended industrial operating temperatures from -40°C to +85°C
• Includes multiple high-speed interfaces such as PCIe, USB 3.0, and GbE
• Compact form factor optimized for space-constrained embedded designs

Applications

• Industrial automation and control systems
• Medical imaging devices requiring high processing power
• Automotive infotainment and instrument clusters
• Telecommunications infrastructure equipment
• Portable test and measurement instruments

Procurement Notes

Verify component authenticity through authorized Trenz Electronic distributors or direct channels. Confirm specific revision levels and manufacturing dates against current production status. Ensure compatibility with existing carrier board designs regarding pinout and power requirements. Request official datasheets and mechanical drawings for integration validation. Check for any end-of-life notifications or recommended replacement parts if sourcing for long-term projects.

Selection Notes

Select this module when a combined FPGA and processor solution is required within a compact footprint. Consider the available I/O resources and memory capacity relative to application demands. Evaluate thermal management solutions suitable for the specified operating temperature range. Compare performance metrics against standalone SoCs or FPGAs to determine system-level efficiency. Verify software support availability for the specific Zynq UltraScale+ silicon variant.

Part Context

This module belongs to the Trenz Electronic TE0803 product family, which focuses on Xilinx Zynq UltraScale+ MPSoC implementations. These modules are designed to accelerate development cycles by providing pre-validated hardware platforms. They serve as core components for various embedded systems, bridging the gap between complex FPGA designs and ready-to-use computing solutions.

Replacement Considerations

Consult Trenz Electronic for officially supported alternative modules within the same product line. Verify mechanical and electrical compatibility before substituting with third-party SOMs. Review updated datasheets for changes in pin assignments or supported peripherals. Ensure that firmware and software drivers remain compatible with the replacement hardware.