TE0807-03-4AI21-A

Overview

The TE0807-03-4AI21-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ MPSoC with the XCZU9EG-2FFVC1760E processor. The module includes 4 GByte of DDR4 SDRAM and supports industrial operating temperatures ranging from -40°C to +85°C. Key interfaces include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0. The physical footprint measures 4 cm by 5 cm.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual ARM Cortex-A53 cores and programmable logic
• Supports multiple high-speed peripheral interfaces including PCIe and SATA 3.1
• Industrial temperature rating ensures reliable operation in harsh environments
• Compact 4x5 cm form factor suitable for space-constrained designs

Applications

• Industrial automation and control systems
• Medical imaging equipment
• Telecommunications infrastructure
• Automotive infotainment and telematics

Procurement Notes

This component is officially listed as End-of-Life (EOL) by the manufacturer. Availability is restricted or discontinued across major distributors. Engineers must verify current stock status through official channels before design finalization. Replacement planning should commence immediately due to limited supply chain continuity.

Selection Notes

Select this module when a compact SOM requires integrated processing and programmability on a single chip. It is suitable for designs needing direct connectivity to storage via SATA or high-speed expansion via PCIe. Verify that the target application can accommodate the specific pinout and thermal requirements of the FFVC1760 package.

Part Context

This part belongs to the TE0807 family of System-on-Modules from Trenz Electronic. These modules are engineered around Xilinx/AMD Zynq UltraScale+ devices, combining hard processor systems with flexible FPGA fabric. The series targets developers seeking to reduce board-level complexity while maintaining high computational throughput.

Replacement Considerations

As the product is discontinued, no direct public substitutes are confirmed. Designers should evaluate newer generations of Zynq UltraScale+ MPSoCs or alternative vendor SOMs with comparable interface counts and form factors. Migration requires revalidation of hardware compatibility and software drivers.