TE0808-04-6BE21-L

Overview

The TE0808-04-6BE21-L is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory with a maximum capacity of 512 MByte. The module provides 20 Gigabit transceivers (4 GTR, 16 GTH) and extensive I/Os including 65 PS MIOs, 48 PL HD GPIOs, and 156 PL HP GPIOs. It operates within a compact 52 x 76 mm form factor.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system and programmable logic.
• Includes onboard Si5345A programmable PLL clock generator with ten configurable outputs.
• Features four Board-to-Board connectors with 160 contacts each for high-speed signal routing.
• Supports single 3.3V power source requirement with integrated DC-DC regulators and LDOs.

Applications

• High-performance embedded digital signal processing systems
• Industrial automation and process control applications
• High-speed data acquisition and precision measurement systems
• Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific revision level against the TRM document v.32 or later. Confirm that the baseboard design accommodates the 52 x 76 mm footprint and the required 3.3V input voltage range. Ensure compatibility with the selected boot mode configuration via the J2 connector pins. Check for any specific environmental certifications required for the deployment location.

Selection Notes

Select this module when a high-density MPSoC solution is required within a 5.2 x 7.6 cm envelope. It is suitable for designs needing significant parallel processing capabilities alongside dedicated hardware acceleration. Consider the available MGT lanes for high-speed serial interfaces. Evaluate the thermal requirements as the XCZU9EG package generates substantial heat under heavy load.

Part Context

This module belongs to the Trenz Electronic TE0808 series, which utilizes the Xilinx Zynq UltraScale+ MPSoC family. The series offers various memory configurations and form factors tailored for different performance tiers. The TE0808 specifically targets applications requiring robust industrial reliability and extensive connectivity options through its rugged stacking connectors.

Replacement Considerations

No public confirmed substitutes are listed in the documentation. Alternative modules from the same manufacturer may offer different pin counts or memory capacities but will require baseboard redesign due to varying connector layouts and component placements.