TE0808-04-9GI21-A

Overview

The Trenz Electronic TE0808-04-9GI21-A is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ XCZU9EG MPSoC. It features up to 8 GBytes of DDR4 SDRAM via a 64-bit data bus and dual SPI Flash memory totaling 512 MByte. The module provides 20 Gigabit transceivers (4 GTR, 16 GTH) and extensive I/Os including 65 PS MIOs and 204 PL GPIOs. It utilizes four 160-pin Board-to-Board connectors for high-speed stacking connections.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ XCZU9EG MPSoC with heterogeneous processing system
• Supports up to 8 GBytes DDR4 SDRAM and dual parallel boot SPI Flash
• Includes Si5345A programmable PLL clock generator with multiple outputs
• Features rugged high-speed stacking B2B connectors for signal access

Applications

• High-performance embedded digital signal processing systems
• Industrial automation and process control applications
• High-speed data acquisition and precision measurement systems
• Automotive and advanced embedded computing platforms

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to ensure component availability and revision alignment. Confirm that the baseboard design supports the required 3.3V single power source input and interfaces with the four 160-pin B2B connectors. Check documentation for any hardware revision updates affecting pin assignments or power sequencing requirements.

Selection Notes

Select this module when a compact form factor is required alongside high-density memory and extensive high-speed serial connectivity. Ensure the application leverages the separate power domains for LP, FP, and PL sections to optimize energy efficiency. Verify that the baseboard can accommodate the 5.2 x 7.6 cm dimensions and provides necessary thermal management for the skyline heat spreader mounting holes.

Part Context

This module belongs to the TE0808 series, designed by Trenz Electronic GmbH as a scalable solution based on the Xilinx Zynq UltraScale+ architecture. The series targets developers needing robust FPGA and CPU integration within a standardized footprint. It complements Trenz Electronic's ecosystem of carrier boards and development tools for rapid prototyping.

Replacement Considerations

Consult the official Trenz Electronic documentation for confirmed substitute models within the TE0808 family. Verify compatibility regarding pinout definitions and mechanical constraints before transitioning designs. No direct cross-manufacturer equivalents are documented in the provided technical specifications.