TE0808-05-6BE21-L

Overview

The TE0808-05-6BE21-L is a heat spreader manufactured by Trenz Electronic, designed specifically for the TE0808-05 MPSoC module. This component serves as a thermal management solution to dissipate heat generated by the system-on-chip during operation. It utilizes a screw-mount installation style to ensure secure attachment and effective thermal contact with the underlying processor die or package.

Feature Summary

• Designed exclusively for the TE0808-05 MPSoC module
• Screw-mount installation for secure thermal coupling
• Acts as a heat spreader for high-performance processing units

Applications

• Thermal management for Zynq UltraScale+ MPSoC modules
• Embedded systems requiring active or passive cooling of SoCs
• Industrial control hardware utilizing Trenz Electronic carrier boards

Procurement Notes

Verify compatibility with the specific TE0808-05 module variant before integration. Confirm mechanical fitment and screw hole alignment with the target carrier board design. Ensure the heat spreader material properties meet the thermal requirements of the application environment. Check for any recent product change notifications from Trenz Electronic regarding this accessory.

Selection Notes

Select this component only when using the TE0808-05 module. It is not a universal heat sink but a form-factor-specific accessory. Consider the thermal resistance path between the module and the spreader. Evaluate if additional thermal interface materials are required to optimize heat transfer efficiency in the final assembly.

Part Context

This part belongs to the accessory category for Trenz Electronic's TE0808 series of MPSoC modules. It complements the core processing module by providing necessary thermal dissipation capabilities. The product line focuses on ruggedized and high-performance computing solutions based on Xilinx/AMD silicon.