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The Trenz Electronic TE0808-05-9BE21-A is an industrial-grade System-on-Module integrating an AMD Zynq UltraScale+ MPSoC (ZU6/ZU9/ZU15) within a compact 76 mm x 52 mm form factor. It features 4 GByte DDR4 SDRAM and dual 64 MByte Quad SPI Flash for configuration. The module provides extensive I/O via four high-speed B2B connectors, supporting up to 204 PL I/Os, 65 PS MIOs, and multiple transceivers including 4 GTR and 16 GTH lanes.
Verify the specific assembly option and temperature grade required for your application, as these affect component selection and operating conditions. Confirm that the baseboard design supports the recommended power supply currents for each domain. Ensure compatibility with the Samtec ST5/SS5 connector specifications for proper mechanical mating and electrical performance.
Select the appropriate SoC variant (ZU6, ZU9, or ZU15) based on resource requirements. Consider the speedgrade (-1 or -2) and engine type (CG or EG) for performance needs. Verify thermal management solutions, as operating temperatures depend on design usage and cooling. Check if higher input voltages are supported by specific assembly options.
This module belongs to the TE0808 family from Trenz Electronic, designed for ultra-compact industrial applications. It utilizes the UltraSoM+ standard with a 5.2 cm x 7.6 cm footprint. The family supports various AMD Zynq UltraScale+ devices, offering scalability in terms of logic resources and memory configurations for diverse embedded computing tasks.
No public confirmed substitutes are available. The TE0808 series is proprietary to Trenz Electronic. Replacement requires evaluating carrier board compatibility, specifically the Samtec Razor Beam connector interface and power delivery architecture. Alternative modules may require significant redesign of the baseboard and software stack.