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Product Detailed Parameters
- Description：ULTRASOM+ MPSOC MODULE WITH ZYNQ
- Series：-
- Mfr：Trenz Electronic GmbH
- Package：Bulk
- Module/Board Type：-
- Core Processor：-
- Co-Processor：-
- Speed：-
- Flash Size：-
- RAM Size：-
- Connector Type：-
- Size / Dimension：-
- Operating Temperature：-
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Overview
The TE0808-05-9BE81-EK is a System-on-Module (SOM) evaluation kit manufactured by Trenz Electronic. It integrates an AMD Zynq UltraScale+ RFSoC FPGA, featuring embedded DDR4 memory and high-speed radio frequency data converters. The module is designed for compact form factors suitable for demanding industrial and communication applications requiring high-performance signal processing.
Feature Summary
- Integrates AMD Zynq UltraScale+ RFSoC FPGA with embedded processing hardening
- Includes on-module DDR4 memory for high-bandwidth data handling
- Provides integrated RF transceiver capabilities for direct sampling applications
- Supplied as an evaluation kit for rapid prototyping and development
Applications
- Software-defined radio systems
- High-speed digital signal processing
- Advanced radar and electronic warfare systems
- Industrial automation control units
Procurement Notes
Verify the specific revision level of the RFSoC silicon and the included carrier board compatibility before procurement. Confirm that the evaluation kit includes all necessary cabling and documentation for initial setup. Check for any regional export control classifications associated with high-performance FPGA components.
Selection Notes
Select this kit when immediate access to the complete hardware ecosystem is required for early-stage design validation. It serves as the primary reference platform for developing custom baseboards using the TE0808 module specifications. Ensure the development environment supports the specific FPGA toolchain versions compatible with the installed silicon.
Part Context
This part belongs to the TE0808 series of SoM products from Trenz Electronic, which focuses on AMD Xilinx Zynq UltraScale+ MPSoC and RFSoC technologies. The series is engineered for space-constrained environments requiring robust processing power. The suffix indicates a specific evaluation kit configuration rather than a standalone module.
Replacement Considerations
No public confirmed substitutes are available. Alternative solutions require redesigning the carrier board and software stack due to unique pinout definitions and mechanical constraints specific to the Trenz Electronic TE0808 form factor.
