TE0808-05-9GI21-EK

Overview

The TE0808-05-9GI21-EK is a System-on-Module (SoM) manufactured by Trenz Electronic GmbH. It integrates the Xilinx Zynq UltraScale+ RFSoC FPGA, combining programmable logic with ARM Cortex-A53 and Cortex-R5 processors alongside high-speed analog-to-digital and digital-to-analog converters. The module features integrated DDR4 memory and provides extensive I/O connectivity through standard form factors, designed for complex signal processing applications requiring both digital control and high-bandwidth RF data handling capabilities.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ RFSoC FPGA with embedded ARM processors
• Includes on-module DDR4 memory for high-speed data buffering
• Supports high-performance mixed-signal processing via integrated ADCs and DACs
• Designed for compact industrial and aerospace environments

Applications

• Software-defined radio systems
• High-speed oscilloscopes and test equipment
• Aerospace and defense radar processing
• Medical imaging systems

Procurement Notes

Verify the specific suffix codes against the manufacturer's current documentation to ensure compatibility with required carrier boards. Confirm that the selected variant matches the intended operating temperature range and memory configuration. Cross-reference the part number with official Trenz Electronic resources to validate availability of necessary development tools and board support packages.

Selection Notes

Select this module when an application requires tight integration of RF front-end processing with general-purpose computing. Compare performance metrics against standalone FPGA solutions if cost or power consumption is critical. Ensure the carrier board design supports the high-density pinout and thermal requirements of the RFSoC architecture.

Part Context

This component belongs to the Trenz Electronic TE08xx series of SoMs based on Xilinx Zynq UltraScale+ devices. These modules are engineered to reduce development time by providing pre-validated hardware foundations. They serve as core processing units for custom carrier designs in demanding embedded applications.

Replacement Considerations

Direct replacements may include other Trenz Electronic modules using similar Xilinx silicon but with different memory configurations or I/O counts. Verify mechanical footprint compatibility with existing carrier boards before substituting.