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The TE0808-05-BBE21-A is a System-on-Module (SoM) manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ RFSoC FPGA, specifically the XCZU9EG-2FFVC1760E variant, providing combined processing and radio frequency capabilities. The module includes 4 GB of LPDDR4 memory and 16 GB of eMMC storage. It operates within an industrial temperature range of -40°C to +85°C and features a compact form factor suitable for space-constrained designs requiring advanced signal processing.
Verify component availability as production status may vary. Confirm specific suffix requirements for your application, as variations exist within the TE0808 series. Ensure compatibility with carrier boards supporting the required pinout and power specifications. Check for end-of-life notifications or alternative recommendations from the manufacturer before finalizing procurement plans.
Select this module when both high-throughput digital signal processing and direct RF transceiver functionality are required in a single package. Consider the thermal performance and ensure adequate cooling solutions, such as the KK0808-05 heat spreader, are integrated into the design. Evaluate memory bandwidth requirements against the LPDDR4 configuration provided.
This part belongs to the Trenz Electronic TE0808 series, which focuses on Xilinx Zynq UltraScale+ RFSoC technology. The series provides modular solutions for applications demanding high-speed data conversion alongside programmable logic. Trenz Electronic specializes in embedding these complex SoCs into reliable, industrial-grade modules with standardized interfaces.
No publicly confirmed direct substitutes are available. Designers should evaluate other RFSoC-based modules from Trenz Electronic or consider redesigning around different FPGA families if supply constraints arise. Verify mechanical and electrical compatibility if switching between similar modules within the same manufacturer's portfolio.