TE0813-02-2AE81-A

Overview

The Trenz Electronic TE0813-02-2AE81-A is an industrial-grade System-on-Module integrating an AMD Zynq UltraScale+ MPSoC with SFVC784 package. It features 4 GByte DDR4 SDRAM and dual 64 MByte Quad SPI Flash memory. The module provides up to 204 programmable logic I/Os, including high-speed transceivers (GTR/GTH), via four 240-pin board-to-board connectors. Operating within extended temperature ranges, it supports flexible power sequencing for processing system and programmable logic domains.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with configurable engine types and speed grades
• Includes onboard 4 GByte DDR4 SDRAM and dual serial flash configuration memory
• Provides rugged high-density board-to-board interconnects supporting PCIe 5.0 speeds
• Supports independent power-up sequencing for PS, PL, and transceiver domains

Applications

• Industrial automation controllers requiring robust FPGA capabilities
• High-speed data acquisition systems utilizing GTH/GTY transceivers
• Embedded vision processing units leveraging the programmable logic fabric
• Telecommunications infrastructure nodes requiring low-latency signal processing

Procurement Notes

Verify the specific assembly option and speed grade corresponding to the ordering suffix, as these determine available transceivers and I/O counts. Confirm that the baseboard design accommodates the required power rails and stacking height. Ensure the carrier board supports the necessary boot mode configurations via the JTAG and I2C interfaces. Check for any hardware revision differences that may affect signal routing or power enable requirements.

Selection Notes

Select this module when a compact form factor with high-performance MPSoC integration is required. Consider the specific SoC variant (ZU1-ZU5) based on the needed DSP slices and block RAM resources. Evaluate the transceiver count against application bandwidth needs, noting that GTH availability depends on the chosen device. Ensure the thermal solution supports the recommended current ratings for the full-power domain and programmable logic supplies.

Part Context

This part belongs to the TE0813 UltraSoM+ family from Trenz Electronic, designed for space-constrained industrial applications. The series utilizes standard Samtec AcceleRate HD connectors for reliable high-speed communication. The module architecture emphasizes flexibility in power management and interface configuration, allowing adaptation to various carrier board designs while maintaining industrial reliability standards.

Replacement Considerations

Direct replacements must match the SFVC784 package and pinout compatibility of the Zynq UltraScale+ series. Verify that alternative modules support the same 4 GByte DDR4 configuration and dual SPI flash layout. Ensure the replacement maintains the 5.2 cm x 7.6 cm physical dimensions and connector stacking height to fit existing mechanical enclosures and carrier boards without redesign.

FAQ

How are the processing system and programmable logic power domains controlled?

The PS and PL domains can be enabled independently using dedicated enable signals (EN_FPD, EN_LPD, EN_PL). This allows for flexible power sequencing where the PL can operate without the PS, provided the necessary clock and voltage references are active.

What is the maximum data rate supported by the board-to-board connectors?

The Samtec AcceleRate HD connectors support a maximum data rate of 56 Gbps at a standard stacking height of 5 mm. This enables compliance with PCIe 5.0 specifications for high-bandwidth applications.

Does the module come pre-programmed with firmware?

No, the DDR4 SDRAM, Quad SPI Flash, and EEPROM are not programmed upon delivery, except for the factory-programmed MAC address in the EEPROM. Users must load their own bitstreams and software onto the storage devices.