TE0813-02-3BE81-A

TE0813-02-3BE81-A

$442.79
  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+

SKU:b3929716797f Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH AMD ZYNQ ULTRA
  • Series:Zynq UltraScale+
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0813-02-3BE81-A

Overview

The TE0813-02-3BE81-A is a System-on-Module starter kit manufactured by Trenz Electronic. It integrates a TE0813-02-3BE81-A module featuring an AMD Zynq UltraScale+ ZU3EG processor onto a TEBF0818-02 baseboard. The assembly includes a heatsink for thermal management. This configuration serves as a development platform for embedded applications utilizing the specified MPSoC architecture.

Feature Summary

  • Integrates Zynq UltraScale+ ZU3EG processor on a dedicated SOM
  • Includes TEBF0818-02 baseboard for expanded I/O and connectivity
  • Comes with integrated heatsink for thermal regulation

Applications

  • Embedded system prototyping
  • Industrial control development
  • Research and educational FPGA platforms

Procurement Notes

This product is listed as discontinued or end-of-life. Availability is restricted, and Mouser indicates it is not currently sold in all regions. Verification of current supply status and alternative sourcing through official Trenz Electronic channels is required before procurement planning.

Selection Notes

Select this kit for rapid development using the ZU3EG MPSoC. Ensure compatibility with the TEBF0818-02 baseboard requirements. Verify that the included thermal solution meets the specific environmental operating conditions of the target application.

Part Context

Trenz Electronic specializes in FPGA and SoM solutions based on AMD, Altera, Microchip, and Lattice technologies. The company provides modular, scalable embedded solutions ranging from prototyping to series production, supported by direct engineering assistance.

TE0813-02-3BE81-ATE0813-02-3BE81-A
$442.79
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