SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE0813-02-3BE81-A is a System-on-Module starter kit manufactured by Trenz Electronic. It integrates a TE0813-02-3BE81-A module featuring an AMD Zynq UltraScale+ ZU3EG processor onto a TEBF0818-02 baseboard. The assembly includes a heatsink for thermal management. This configuration serves as a development platform for embedded applications utilizing the specified MPSoC architecture.
This product is listed as discontinued or end-of-life. Availability is restricted, and Mouser indicates it is not currently sold in all regions. Verification of current supply status and alternative sourcing through official Trenz Electronic channels is required before procurement planning.
Select this kit for rapid development using the ZU3EG MPSoC. Ensure compatibility with the TEBF0818-02 baseboard requirements. Verify that the included thermal solution meets the specific environmental operating conditions of the target application.
Trenz Electronic specializes in FPGA and SoM solutions based on AMD, Altera, Microchip, and Lattice technologies. The company provides modular, scalable embedded solutions ranging from prototyping to series production, supported by direct engineering assistance.