TE0813-02-4BE81-A

Overview

The Trenz Electronic TE0813-02-4BE81-A is an industrial-grade System-on-Module integrating an AMD Zynq UltraScale+ MPSoC. It features a 64-bit DDR4 SDRAM interface, SPI Boot Flash memory, and switch-mode power supplies. The module utilizes rugged high-speed stacking connections to provide configurable I/Os within a compact 5.2 cm x 7.6 cm form factor.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with up to 8 GByte DDR4 SDRAM
• Includes onboard Quad SPI Flash for configuration and operation
• Features four high-density board-to-board connectors supporting up to 56 Gbps data rates
• Provides integrated switch-mode power delivery subsystem

Applications

• Industrial automation systems requiring robust processing
• Medical imaging devices needing high-speed data acquisition
• Aerospace and defense applications demanding extended temperature ranges
• Telecommunications infrastructure equipment
• Test and measurement instrumentation

Procurement Notes

Verify the specific assembly options and speed grade required for your design, as these affect available interfaces like MGT transceivers. Confirm that the baseboard power supply meets the recommended current ratings for the low-power, full-power, and programmable logic domains. Check for any product change notifications or end-of-life status updates directly from Trenz Electronic before finalizing procurement plans.

Selection Notes

Select this module when an industrial-grade MPSoC solution with flexible power domain control is required. Ensure the carrier board supports the 5.2 cm x 7.6 cm form factor and mates with the specified Samtec AcceleRate HD connectors. Consider the thermal requirements of the SoC and the maximum power consumption of the chosen assembly variant when designing the cooling solution.

Part Context

This module belongs to the TE0813 UltraSoM+ family, designed for high-performance embedded applications. It serves as a core computing element for Trenz Electronic's ecosystem, allowing developers to leverage the capabilities of AMD Zynq UltraScale+ MPSoCs without managing complex PCB layout challenges associated with high-speed signals and dense pin counts.

Replacement Considerations

No public confirmed substitutes are listed in the documentation. As this is a specialized SOM, direct replacements require evaluating mechanical compatibility, connector pitch, and pinout definitions against alternative modules from Trenz Electronic or other vendors.