TE0813-02-5DE81-A

Overview

The TE0813-02-5DE81-A is a System-on-Module manufactured by Trenz Electronic, integrating an AMD Zynq UltraScale+ MPSoC. This module features a 4 x 5 cm form factor and includes 2 GByte of DDR4 SDRAM. It supports industrial operating temperatures ranging from -40°C to +85°C. The component provides multiple interface options including DisplayPort, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, and USB 3.0 for versatile embedded connectivity.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors
• Includes onboard 2 GByte DDR4 SDRAM for high-speed data processing
• Supports rugged industrial temperature ranges suitable for demanding environments
• Provides comprehensive I/O interfaces including PCIe, SATA, and USB 3.0

Applications

• Industrial automation and control systems requiring real-time processing
• Medical imaging devices needing high-bandwidth data throughput
• Automotive infotainment and instrument cluster applications
• Test and measurement equipment utilizing FPGA programmability

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply. Confirm the exact processor speed grade and memory configuration matches project requirements. Check for updated engineering change notices or alternative pin-compatible modules within the TE0813 family. Ensure compatibility with designated carrier boards for proper signal integrity and power delivery.

Selection Notes

Select this module when a compact 4x5cm footprint is required alongside significant processing power from the Zynq UltraScale+ architecture. Consider the integrated DDR4 capacity for applications handling large datasets. Evaluate the available interface count against system connectivity needs. Verify that the industrial temperature rating aligns with the deployment environment constraints.

Part Context

Trenz Electronic specializes in FPGA and SoM solutions, offering modular designs that simplify integration into custom carrier boards. The TE0813 series represents their compact MPSoC offerings, designed to accelerate development cycles for complex embedded systems. These modules provide a standardized interface to reduce hardware design risks associated with fine-pitch BGA components.

Replacement Considerations

Consult official documentation for confirmed substitute parts within the TE0813 series or compatible MPSoC modules. Verify pinout and electrical parameter compatibility before transitioning to alternative vendors. Review end-of-life notifications to ensure long-term supply chain stability for production volumes.