TE0818-01-BBE21-A

TE0818-01-BBE21-A

$1,377.86
  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™

SKU:f2724a12db14 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0818-01-BBE21-A

Overview

The TE0818-01-BBE21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC to provide combined processing and programmable logic capabilities. The module features integrated DDR4 memory and supports high-speed interfaces including PCIe, SATA, and USB. Designed for compact form factors, it enables rapid prototyping and deployment in industrial environments requiring high-performance data processing and real-time control.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and FPGA fabric
  • Supports high-speed serial interfaces including PCIe Gen3 and SATA
  • Includes onboard DDR4 SDRAM for system memory
  • Compact hardware design suitable for space-constrained embedded systems

Applications

  • Industrial automation and machine control systems
  • High-speed data acquisition and signal processing
  • Embedded vision and image processing applications
  • Telecommunications infrastructure equipment
  • Medical imaging devices

Procurement Notes

Verify component availability through authorized distributors as supply status may vary. Confirm RoHS compliance and environmental specifications prior to integration. Review the latest product change notifications for any updates to pinout or firmware requirements. Ensure compatibility with existing carrier board designs before procurement.

Selection Notes

Select this module when a combination of soft processor cores and reconfigurable logic is required. Consider the specific I/O requirements of the target application against the available pins on the module connector. Evaluate thermal management needs based on the expected workload of the FPGA fabric and processors.

Part Context

Trenz Electronic specializes in FPGA and SoM solutions for industrial and automotive sectors. This module belongs to their portfolio of compact, high-performance embedded systems. The company provides engineering support and development tools to facilitate integration into custom hardware designs.

Replacement Considerations

Check for end-of-life notices from the manufacturer. Identify alternative modules within the same family that offer compatible pinouts and interface sets. Verify that any substitute maintains the required performance levels for both the ARM processors and the FPGA fabric.

TE0818-01-BBE21-ATE0818-01-BBE21-A
$1,377.86
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