TE0818-02-9GI81-A

Overview

The Trenz Electronic TE0818-02-9GI81-A is an industrial-grade System-on-Module integrating an AMD Zynq UltraScale+ MPSoC (ZU6/ZU9/ZU15) within a compact 76 mm x 52 mm form factor. It features up to 4 GByte DDR4 SDRAM and dual Quad SPI Flash memory for configuration. The module provides extensive connectivity via four high-speed B2B connectors, supporting up to 204 PL I/Os, 65 PS MIOs, and multiple GTH/GTR transceivers. Power management includes dedicated domains for the processing system and programmable logic.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with configurable engine types and speed grades
• Supports flexible power sequencing for independent Processing System and Programmable Logic domains
• Includes on-board peripherals such as clock generators, oscillators, and EEPROM with MAC address storage
• Provides rugged board-to-board stacking connections for high-speed data transfer

Applications

• Industrial automation and control systems requiring robust processing capabilities
• High-performance embedded computing solutions utilizing FPGA flexibility
• Complex signal processing applications leveraging GTH/GTR transceivers
• Custom carrier board development for specialized hardware interfaces

Procurement Notes

Verify the specific SoC variant (ZU6, ZU9, or ZU15) and package type required for your design, as these options affect pinout and power requirements. Confirm that the baseboard power supply meets the recommended current ratings for the low-power domain, full-power domain, and transceivers. Ensure compatibility with the intended boot mode selection via the JTAG or SPI interfaces.

Selection Notes

Select this module when a compact industrial SOM with high I/O density and advanced transceiver capabilities is needed. Consider the available PL I/O count and transceiver lanes against your interface requirements. Evaluate the thermal solution based on the maximum power consumption of the chosen SoC and memory configuration. Verify that the carrier board supports the necessary voltage levels and connector stacking heights.

Part Context

This module belongs to the Trenz Electronic TE0818 family of UltraSOM+ modules. It is designed to be paired with compatible baseboards, such as the TEBF0818 series, to create complete embedded systems. The module operates independently of the carrier board's logic but relies on it for power delivery and external interface connectivity.

Replacement Considerations

No direct public substitutes are confirmed in the provided documentation. Alternative solutions would require evaluating other MPSoC-based SOMs from different manufacturers, ensuring compatibility with existing mechanical constraints, power specifications, and software ecosystems.