TE0820-03-03EG-1EA

Overview

The TE0820-03 is a 4 x 5 cm industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ MPSoC with up to 4 GByte DDR4 SDRAM and 128 MByte SPI Flash. It features dual Cortex-R5 real-time cores, quad-core or dual-core Cortex-A53 application processors, and four high-speed serial I/O interfaces supporting PCIe, SATA, DisplayPort, USB 3.0, and GMII. The module includes an integrated Marvell Gigabit Ethernet PHY, Microchip USB ULPI transceiver, Lattice CPLD for system control, and eMMC storage.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual Cortex-R5 and quad/dual Cortex-A53 cores
• Includes onboard power management, DDR4 memory, QSPI flash, and eMMC storage
• Features rugged high-speed stacking strip connectors for board-to-board interfacing
• Provides integrated Gigabit Ethernet PHY and high-speed USB ULPI transceiver

Applications

• Industrial automation controllers requiring real-time processing
• Medical imaging systems utilizing high-speed serial interfaces
• Automotive infotainment and display driver applications
• Telecommunications infrastructure equipment
• Test and measurement instrumentation modules

Procurement Notes

Verify the specific processor variant (XCZU2CG/EG or XCZU3CG/EG) required for your performance needs, as core counts vary by assembly option. Confirm that the carrier board supports the 2x100-pin and 1x60-pin Hermaphroditic connector mating heights. Ensure the design accommodates the specified voltage levels for the B2B I/Os, which are primarily 1.8V. Check for any specific boot mode configurations needed via the CPLD firmware.

Selection Notes

Select this module when a compact form factor is critical alongside high-performance mixed-signal processing capabilities. It is suitable for designs requiring multiple high-speed serial protocols like PCIe and SATA without external bridge chips. Consider the available memory options if standard 2GB DDR4 is insufficient. Evaluate the thermal requirements of the Zynq UltraScale+ device under your specific load conditions.

Part Context

This module belongs to Trenz Electronic's 4 x 5 cm SoM family, designed for mechanical compatibility across variants. It serves as a central processing unit for carrier boards, abstracting complex PCB layout requirements for high-speed signals. The TE0820 series leverages Xilinx Zynq UltraScale+ technology to combine programmable logic with ARM processing subsystems in a single package.

Replacement Considerations

Direct replacements depend on the specific Zynq UltraScale+ variant used. Verify pinout compatibility with existing carrier boards if swapping between different MPSoC densities within the same package. Alternative modules from other vendors may require significant schematic and layout changes due to differing connector standards and peripheral integrations.