TE0820-03-04EV-1EA

Overview

The Trenz Electronic TE0820-03-04EV-1EA is an industrial-grade System-on-Module (SoM) featuring a Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E processor. It integrates 2 GByte of 32-bit DDR4 SDRAM and 128 MByte of QSPI flash memory. The module provides high-speed interfaces including PCIe, SATA, DisplayPort, USB 3.0, and Gigabit Ethernet via a Marvell PHY. It operates within a temperature range of -40°C to +85°C and measures 50 mm x 40 mm.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual Cortex-R5 real-time processors and quad-core Cortex-A53 application processors.
• Includes on-board Marvell Alaska 88E1512 Gigabit Ethernet PHY and Microchip USB 3320 ULPI transceiver for high-speed connectivity.
• Features a Lattice MachXO2 system controller CPLD for power management and boot configuration control.
• Provides four PS GTR transceivers accessible via board-to-board connectors for flexible serial I/O protocols.

Applications

• Industrial automation and embedded digital signal processing systems
• High-speed data acquisition and precision measurement equipment
• Automotive industry applications requiring robust computing modules
• PC-based process control and monitoring systems

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production status, as variants may differ in component availability or lifecycle stage. Confirm that the required firmware initialization matches the initial delivery state, particularly regarding SPI Flash OTP and eFUSE settings. Ensure carrier board designs accommodate the specified B2B connector mating heights and voltage levels for reliable signal integrity.

Selection Notes

Select this module when a compact 4x5 cm form factor is required alongside significant processing power from the Zynq UltraScale+ architecture. Choose this variant specifically for the XCZU4EV device which offers distinct resource configurations compared to CG or EG series parts. Consider the integrated peripherals like eMMC and QSPI flash if external storage solutions are undesirable for the target design.

Part Context

This module belongs to the TE0820 family of System-on-Modules produced by Trenz Electronic GmbH. The family is designed for mechanical compatibility across the 4x5 cm footprint, allowing for easy upgrades or downgrades between different Zynq UltraScale+ processor variants without redesigning the carrier board infrastructure.

Replacement Considerations

Direct replacements within the same form factor include other TE0820 variants utilizing XCZU2CG, XCZU2EG, XCZU3CG, or XCZU3EG processors. Verify pinout compatibility and memory configurations when substituting, as peripheral counts and I/O mappings may vary between these specific processor models.