TE0820-04-2BE21FA

TE0820-04-2BE21FA

  • Description:MOD MPSOC ZU2EG-1E 2GB DDR4 IND
  • Series:TE0820

SKU:dcf8231e9da5 Category: Brand:

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Product Detailed Parameters

  • Description:MOD MPSOC ZU2EG-1E 2GB DDR4 IND
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0820-04-2BE21FA

Overview

The TE0820-04-2BE21FA is a System-on-Module manufactured by Trenz Electronic, featuring the Xilinx Zynq UltraScale+ ZU2EG-1E processor. It integrates 2 GByte of DDR4 SDRAM and operates within an industrial temperature range of -40°C to +85°C. The module measures 40 mm x 50 mm and supports interfaces including DisplayPort, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, and USB 3.0.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with embedded ARM processors and programmable logic
  • Includes onboard 2 GByte DDR4 SDRAM for high-bandwidth memory access
  • Supports multiple high-speed peripheral interfaces including PCIe and SATA
  • Designed for industrial environments with extended operating temperature capabilities

Applications

  • Industrial automation and control systems requiring FPGA flexibility
  • Medical imaging devices needing high-performance processing
  • Telecommunications infrastructure equipment
  • Automotive infotainment and instrument clusters

Procurement Notes

This component is officially listed as End-of-Life (EOL) by the manufacturer. Availability is restricted or unavailable through standard distribution channels such as Mouser. Engineers should verify current stock status directly with authorized distributors or consider alternative sourcing strategies due to discontinuation status.

Selection Notes

Select this module when a compact SOM solution is required with the specific ZU2EG-1E silicon variant. Ensure design compatibility with the 4x5 cm form factor and verify that the integrated 2GB DDR4 meets system memory requirements. Confirm interface needs align with the available DP, PCIe, and SATA connections.

Part Context

Part of the TE0820 series from Trenz Electronic, designed for rapid prototyping and production using Xilinx Zynq UltraScale+ MPSoCs. These modules simplify carrier board design by integrating complex power sequencing and signal integrity requirements for the FPGA and memory components.

TE0820-04-2BE21FATE0820-04-2BE21FA

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